📚 Knowledge Connect (35): Call for Papers for 3rd International Conference on recent trends in Microelectronics, Automation, Computing and Communications Systems (ICMACC-26)

Vallurupalli Nageswara Rao (VNR) Vignana Jyothi Institute of Engineering and Technology,  Hyderabad, Telangana, India is organizing the 3rd International Conference on recent trends in Microelectronics, Automation, Computing and Communications Systems (ICMACC-26) in association with IEEE Hyderabad Section during 5th -7th November, 2026.

The 3rd International Conference on Recent Trends in Microelectronics, Automation, Computing and Communications Systems (ICMACC-26) aims to bring together leading academicians, researchers, and industry experts to share their insights on the latest technological advancements. The conference focuses on emerging trends, research challenges, and innovative solutions in the rapidly evolving domains of Microelectronics, Automation, Computing, and Communication Systems. ICMACC-26 provides exceptional opportunities for both academic and industrial communities to engage in discussions on cutting-edge technologies and future research directions. The event will feature keynote addresses, invited talks, refereed papers and poster presentations, pre-conference tutorials, product exhibitions, and panel discussions.

The vision of ICMACC-26 is to foster collaboration and brainstorming so that researchers can exchange ideas, address critical issues in their respective fields, and identify actionable insights that can be implemented in ongoing and future research activities. The Conference is organized into focused engineering tracks, enabling deeper discussions and highly relevant knowledge sharing.

The Conference is technically co-sponsored by IEEE Hyderabad Section and is approved by IEEE with the conference ID: #69869.

Prospective authors are invited to submit original research papers (not being considered for publication elsewhere) in standard IEEE conference template

 https://www.ieee.org/conferences/publishing/templates.html describing the new theoretical and/or experimental research results.

The topics of the conference include, but are not limited to, the following areas:

VLSI Circuits & System Design

Robotics, Automation & Internet of Things

Communications, Sensors and Mobile Networking

Signal, Image, and Multimedia Processing

Computational Intelligence and Computing

Data Science Engineering

Power, Energy and Power Electronics

Additive Manufacturing

Detailed conference tracks/subtracts can be explored at https://icmacc.org/

Paper Submission Link:  https://cmt3.research.microsoft.com/ICMACC2026

Deadline for Full Paper Submission: 25th  May 2026

 

All accepted and presented papers in ICMACC-26 will be submitted to IEEE for further quality/scope check and review. Papers passing the final review will be published by the IEEE Xplore (IEEE’s digital repository, which is Scopus Indexed). Best papers in each track of the Conference will be selected for awards by ICMACC-26.

📚 Knowledge Connect (34): Call for Papers for "Discover Mechanical Engineering"

 Advances in Fatigue and Structural Integrity of Emerging Materials and Structures

The continuous evolution of emerging materials and advanced structural concepts has revolutionized the landscape of engineering design and performance. In recent years, innovations such as meta-structures, l...

Submission status: Open

Submission deadline: 30 September 2026

Advanced Materials for Energy Harvesting and Conversion in Mechanical Systems

We invite original research contributions that explore the role of advanced materials in enhancing energy harvesting and conversion within mechanical systems. This interdisciplinary topic bridges key areas o...

Submission status: Open

Submission deadline: 27 June 2026

Intelligent Controller Design for Dynamic System

At the foundation, the design of the controller begins with system modeling. Various dynamic systems, such as robotic manipulators, electrohydraulic actuators, and renewable energy components, electrical dri...

Submission status: Open

Submission deadline: 20 June 2026

Integrated Vibration Control and Energy Recovery in Engineering Systems

As the demand for efficient energy utilization and enhanced performance in mechanical systems increases, the fields of vibration control and energy harvesting have become critical areas of research. This Col...

Submission status: Open

Submission deadline: 09 March 2026

Advances in Stochastic Control and Perturbation Analysis in Mechanical Systems

This Topical Collection aims to bring together cutting-edge research on stochastic perturbation analysis, with a particular focus on systems governed by Poisson random measures and Markovian switching. The c...

Submission status: Open

Submission deadline: 21 January 2026

Sustainable Development and Mechanical Performance of Bio-Based Composites

The increasing demand for sustainable materials in engineering and manufacturing has led to a significant interest in bio-based composites. These materials offer a unique blend of lightweight properties, mec...

Submission status: Open

Submission deadline: 15 January 2026

Biomedical Applications of Microelectromechanical Systems (MEMS)

MEMS (Micro-Electro-Mechanical Systems) sensors not only utilize the well-known electrical benefits of silicon but also harness its unique mechanical properties to create integrated structures that can detec...

Submission status: Open

Submission deadline: 31 May 2026

Robotics in Agriculture

With the projected increase in global population, the demand for an increase in global food production remains one of the most critical global challenges. Developing more efficient and capable agriculture ro...

Submission status: Open

Submission deadline: 31 December 2025

Recent Advances in Additive Technologies

The progress in the field of mechanical engineering is currently supported by the rapid development of technologies and materials, which make it possible to produce new components with improved functional, a...

Submission status: Open

Submission deadline: 31 January 2026

Contribution of AI and Machine Learning Approaches for Prediction and Material Characterization

Nowadays with the growth of material data from experiments and simulations, a huge amount of data are available which present a new challenge in term of how to process these amount of data. This state requir...

Submission status: Open

Submission deadline: 31 December 2025

Sustainable Advancements in Mechanical Engineering

In today's dynamic global landscape, Mechanical Engineering emerges as a pivotal force in addressing the challenges outlined by the United Nations Sustainable Development Goals (SDGs). Of particular signific...

Submission status: Open

Submission deadline: 31 December 2025

Recent Advances in Ground Mobile Robotics

The adoption of ground mobile robots to replace direct human intervention in dangerous or polluted environments or to avoid risks for the personnel, or to collaborate with them, is going to increase remarkab...

Submission status: Open

Submission deadline: 31 December 2025

Mechatronics Technology in Intelligent Transportation

Mechatronics refers to integrating mechanical, electrical, and electronic engineering with computational capabilities. Designing a mechatronic system involves various disciplines and aims to achieve unique a...

Submission status: Open

Submission deadline: 28 February 2026

Exclusive Papers of Editorial Board Members

Note that articles in this collection are by Editorial Board Members only.

Submission status: Open

Submission deadline: Ongoing

State-of-The-art in Optimisation Based Driveline Design

The design and engineering of machines is increasingly based on optimisation. This enables the minimisation of the initial cost of the components and the electrical energy required to power these machines wi...

Submission status: Open

Submission deadline: Ongoing

 

SOURCE: Springer Link

IIT Bombay and IISER Pune to be mentors to promote research in higher education institutions

"The idea is to promote and improve research work at central and state universities under the mentorship from hub institutions which are already excelling in research,” said Prof Karandikar“Total of 31 institutions across the country having stellar research records have been identified to become hubs (File)

The Indian Institute of Technology (IIT) Bombay from Mumbai and Indian Institute of Science Education and Research (IISER) from Pune are the two institutions from Maharashtra identified as mentors under the Partnerships for Accelerated Innovation and Research (PAIR)–a flagship initiative by the Anusandhan National Research Foundation (ANRF) to promote research in higher education institutions in the country, secretary of Department of Science and Technology, Prof Abhay Karandikar said on Monday.

The ANRF, which aims to foster culture of research in India’s universities, colleges and other research institutions, launched the PAIR initiative a couple of months ago wherein higher educational institutions in the country having excellent research record will mentor other institutions such as central universities and public universities through pairing under ‘hub and spoke’ model.

“Total of 31 institutions across the country having stellar research records have been identified to become hubs. Now they will have to apply for PAIR along with their spoke institutions for a period of five years, on various themes listed for research with focus on multidisciplinary approach. The idea is to promote and improve research work at central and state universities under the mentorship from hub institutions which are already excelling in research,” said Prof Karandikar while adding that the mentorship parameters will have a range of activities from finalising on research topics depending on strengths, guidance on publishing of research papers in high quality journals and also co-supervising PhD students among others.

Each hub and spoke pairing will receive financial support of Rs 100 crore coming from the government through ANRF for a period of five years. “Out of the funding, 70 percent will have to be used for research activities at spoke institutions whereas a hub institution will get to use the remaining 30 percent of the grant. In order to expand the reach of the scheme, each hub institution is required to have one of the spoke institutions which is located outside of the state,” said Prof Karandikar who currently also holds charge on ANRF as CEO.

Prof Karandikar, who will be the chief guest for Mumbai University’s convocation ceremony to be held on Tuesday, delivered a talk at varsity’s Kalina campus a day before on how ANRF is transforming the science and technology landscape in the country. The talk which entailed information on various new schemes under ANRF to enhance research output was attended by several researchers from Mumbai University–faculty as well as students.

In his talk, Prof Karandikar highlighted that research output in the country is concentrated in few institutions with lowest number of (18) institutions having average publication per institute at 7,620 research papers and highest number (115) institutions have average publication per institute of 1,121 research papers while underlining how ANRF is devoted to enhance research and development outputs in institutions across the country.

Source: https://indianexpress.com/article/cities/mumbai/iit-bombay-and-iiser-pune-to-be-mentors-to-promote-research-in-higher-education-institutions-9763583/lite/

Top Searches from “IEEE Xplore Digital Library" - 14th December 2023

 

SN	RESEARCH DOMAIN	RESOURCE	MOST CITED BY PAPERS 1	MOST CITED BY PAPERS 2
1	IMAGE PROCESSING	IEEE XPLORE	J. Deng, W. Dong, R. Socher, L. -J. Li, Kai Li and Li Fei-Fei, "ImageNet: A large-scale hierarchical image database," 2009 IEEE Conference on Computer Vision and Pattern Recognition, Miami, FL, USA, 2009, pp. 248-255, doi: 10.1109/CVPR.2009.5206848. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5206848&isnumber=5206488	C. Szegedy et al., "Going deeper with convolutions," 2015 IEEE Conference on Computer Vision and Pattern Recognition (CVPR), Boston, MA, USA, 2015, pp. 1-9, doi: 10.1109/CVPR.2015.7298594.   URL: URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7298594&isnumber=7298593
2	MACHINE LEARNING	IEEE XPLORE	C. Szegedy et al., "Going deeper with convolutions," 2015 IEEE Conference on Computer Vision and Pattern Recognition (CVPR), Boston, MA, USA, 2015, pp. 1-9, doi: 10.1109/CVPR.2015.7298594. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7298594&isnumber=7298593	J. D. Hunter, "Matplotlib: A 2D Graphics Environment," in Computing in Science & Engineering, vol. 9, no. 3, pp. 90-95, May-June 2007, doi: 10.1109/MCSE.2007.55. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4160265&isnumber=4160244
3	DEEP LEARNING	IEEE XPLORE	K. B. Lee and H. S. Shin, "An Application of a Deep Learning Algorithm for Automatic Detection of Unexpected Accidents Under Bad CCTV Monitoring Conditions in Tunnels," 2019 International Conference on Deep Learning and Machine Learning in Emerging Applications (Deep-ML), Istanbul, Turkey, 2019, pp. 7-11, doi: 10.1109/Deep-ML.2019.00010. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8876906&isnumber=8876888	D. Goularas and S. Kamis, "Evaluation of Deep Learning Techniques in Sentiment Analysis from Twitter Data," 2019 International Conference on Deep Learning and Machine Learning in Emerging Applications (Deep-ML), Istanbul, Turkey, 2019, pp. 12-17, doi: 10.1109/Deep-ML.2019.00011. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8876896&isnumber=8876888
4	ARTIFICIAL INTELLIGENCE	IEEE XPLORE	J. Canny, "A Computational Approach to Edge Detection," in IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. PAMI-8, no. 6, pp. 679-698, Nov. 1986, doi: 10.1109/TPAMI.1986.4767851. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4767851&isnumber=4767846	S. G. Mallat, "A theory for multiresolution signal decomposition: the wavelet representation," in IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. 11, no. 7, pp. 674-693, July 1989, doi: 10.1109/34.192463. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=192463&isnumber=4963
5	CLOUD COMPUTING	IEEE XPLORE	J. Deng, W. Dong, R. Socher, L. -J. Li, Kai Li and Li Fei-Fei, "ImageNet: A large-scale hierarchical image database," 2009 IEEE Conference on Computer Vision and Pattern Recognition, Miami, FL, USA, 2009, pp. 248-255, doi: 10.1109/CVPR.2009.5206848. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5206848&isnumber=5206488	S. G. Mallat, "A theory for multiresolution signal decomposition: the wavelet representation," in IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. 11, no. 7, pp. 674-693, July 1989, doi: 10.1109/34.192463. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=192463&isnumber=4963
6	BIG DATA	IEEE XPLORE	J. Deng, W. Dong, R. Socher, L. -J. Li, Kai Li and Li Fei-Fei, "ImageNet: A large-scale hierarchical image database," 2009 IEEE Conference on Computer Vision and Pattern Recognition, Miami, FL, USA, 2009, pp. 248-255, doi: 10.1109/CVPR.2009.5206848. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5206848&isnumber=5206488	C. Szegedy et al., "Going deeper with convolutions," 2015 IEEE Conference on Computer Vision and Pattern Recognition (CVPR), Boston, MA, USA, 2015, pp. 1-9, doi: 10.1109/CVPR.2015.7298594. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7298594&isnumber=7298593
7	IOT	IEEE XPLORE	A. Al-Fuqaha, M. Guizani, M. Mohammadi, M. Aledhari and M. Ayyash, "Internet of Things: A Survey on Enabling Technologies, Protocols, and Applications," in IEEE Communications Surveys & Tutorials, vol. 17, no. 4, pp. 2347-2376, Fourthquarter 2015, doi: 10.1109/COMST.2015.2444095. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7123563&isnumber=7331734	W. Shi, J. Cao, Q. Zhang, Y. Li and L. Xu, "Edge Computing: Vision and Challenges," in IEEE Internet of Things Journal, vol. 3, no. 5, pp. 637-646, Oct. 2016, doi: 10.1109/JIOT.2016.2579198. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7488250&isnumber=7563473
8	VLSI	IEEE XPLORE	P. N. Belhumeur, J. P. Hespanha and D. J. Kriegman, "Eigenfaces vs. Fisherfaces: recognition using class specific linear projection," in IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. 19, no. 7, pp. 711-720, July 1997, doi: 10.1109/34.598228. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=598228&isnumber=13123	P. Perona and J. Malik, "Scale-space and edge detection using anisotropic diffusion," in IEEE Transactions on Pattern Analysis and Machine Intelligence, vol. 12, no. 7, pp. 629-639, July 1990, doi: 10.1109/34.56205. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=56205&isnumber=2032
9	CYBER SECURITY	IEEE XPLORE	A. Al-Fuqaha, M. Guizani, M. Mohammadi, M. Aledhari and M. Ayyash, "Internet of Things: A Survey on Enabling Technologies, Protocols, and Applications," in IEEE Communications Surveys & Tutorials, vol. 17, no. 4, pp. 2347-2376, Fourthquarter 2015, doi: 10.1109/COMST.2015.2444095. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7123563&isnumber=7331734	E. G. Larsson, O. Edfors, F. Tufvesson and T. L. Marzetta, "Massive MIMO for next generation wireless systems," in IEEE Communications Magazine, vol. 52, no. 2, pp. 186-195, February 2014, doi: 10.1109/MCOM.2014.6736761. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6736761&isnumber=6736727
10	BLOCKCHAIN	IEEE XPLORE	K. Christidis and M. Devetsikiotis, "Blockchains and Smart Contracts for the Internet of Things," in IEEE Access, vol. 4, pp. 2292-2303, 2016, doi: 10.1109/ACCESS.2016.2566339. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7467408&isnumber=7419931	W. Saad, M. Bennis and M. Chen, "A Vision of 6G Wireless Systems: Applications, Trends, Technologies, and Open Research Problems," in IEEE Network, vol. 34, no. 3, pp. 134-142, May/June 2020, doi: 10.1109/MNET.001.1900287. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8869705&isnumber=9105918
11	NOMA	IEEE XPLORE	L. Dai, B. Wang, Y. Yuan, S. Han, I. Chih-lin and Z. Wang, "Non-orthogonal multiple access for 5G: solutions, challenges, opportunities, and future research trends," in IEEE Communications Magazine, vol. 53, no. 9, pp. 74-81, September 2015, doi: 10.1109/MCOM.2015.7263349. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7263349&isnumber=7263333	Z. Ding, X. Lei, G. K. Karagiannidis, R. Schober, J. Yuan and V. K. Bhargava, "A Survey on Non-Orthogonal Multiple Access for 5G Networks: Research Challenges and Future Trends," in IEEE Journal on Selected Areas in Communications, vol. 35, no. 10, pp. 2181-2195, Oct. 2017, doi: 10.1109/JSAC.2017.2725519. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7973146&isnumber=8038094
12	WIND TURBINE MONITORING	IEEE XPLORE	J. M. Guerrero, J. C. Vasquez, J. Matas, L. G. de Vicuna and M. Castilla, "Hierarchical Control of Droop-Controlled AC and DC Microgrids—A General Approach Toward Standardization," in IEEE Transactions on Industrial Electronics, vol. 58, no. 1, pp. 158-172, Jan. 2011, doi: 10.1109/TIE.2010.2066534. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5546958&isnumber=5662271	J. Rocabert, A. Luna, F. Blaabjerg and P. Rodríguez, "Control of Power Converters in AC Microgrids," in IEEE Transactions on Power Electronics, vol. 27, no. 11, pp. 4734-4749, Nov. 2012, doi: 10.1109/TPEL.2012.2199334. URL: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6200347&isnumber=6222041